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The Resource Miniaturized testing of engineering materials, author: V. Karthik, K.V. Kasiviswanathan, Baldev Raj, (electronic resource)

Miniaturized testing of engineering materials, author: V. Karthik, K.V. Kasiviswanathan, Baldev Raj, (electronic resource)

Label
Miniaturized testing of engineering materials
Title
Miniaturized testing of engineering materials
Statement of responsibility
author: V. Karthik, K.V. Kasiviswanathan, Baldev Raj
Creator
Contributor
Author
Subject
Language
eng
Member of
Cataloging source
N$T
http://library.link/vocab/creatorName
Karthik, V
Dewey number
620.1/127
Index
no index present
Literary form
non fiction
Nature of contents
dictionaries
http://library.link/vocab/relatedWorkOrContributorDate
1947-
http://library.link/vocab/relatedWorkOrContributorName
  • Kasiviswanathan, K. V
  • Raj, Baldev
Series statement
Advanced materials science and technology
http://library.link/vocab/subjectName
  • Materials
  • Materials
  • Microchemistry
Label
Miniaturized testing of engineering materials, author: V. Karthik, K.V. Kasiviswanathan, Baldev Raj, (electronic resource)
Instantiates
Publication
Antecedent source
unknown
Carrier category
online resource
Carrier category code
cr
Carrier MARC source
rdacarrier
Color
multicolored
Content category
text
Content type code
txt
Content type MARC source
rdacontent
Contents
  • Techniques for Mechanical Property Characterization
  • 2.6.
  • Concluding Remarks
  • References
  • 3.
  • Miniature Specimens for Fatigue and Fracture Properties
  • 3.1.
  • Subsize Charpy Specimen Impact Testing
  • 3.1.1.
  • Energy Correlation
  • 3.1.2.
  • 1.4.
  • Transition Temperature Correlation
  • 3.1.3.
  • Scaling of Instrumented Impact Test Parameters
  • 3.1.4.
  • Challenges in Subsize Impact Testing
  • 3.2.
  • Fracture Toughness KIC/JIC with Subsize Specimens
  • 3.2.1.
  • Toughness in Transition Regime
  • 3.3.
  • Standards for Mechanical Testing
  • Specimen Reconstitution Methods
  • 3.4.
  • Fatigue and Fatigue Crack Growth Studies Using Subsize Specimens
  • 3.4.1.
  • Fatigue Crack Growth Studies
  • 3.5.
  • Fracture Toughness from Small Punch Technique
  • 3.5.1.
  • Ductile--Brittle Transition from Small Punch
  • 3.5.2.
  • 1.5.
  • Toughness---Lower and Upper Shelf
  • 3.5.3.
  • Small Punch Using Notched Specimen
  • 3.6.
  • Fracture Toughness from Indentation Techniques
  • 3.6.1.
  • Indentation Energy to Fracture
  • 3.6.2.
  • Continuum Damage Mechanics Approach
  • 3.7.
  • Specimen Dimensions
  • Concluding Remarks
  • References
  • 4.
  • Critical Issues in Small Specimen Testing
  • 4.1.
  • Introduction
  • 4.2.
  • Specimen Size Effects and Their Influence on Mechanical Behavior
  • 4.2.1.
  • Size Effect in Subsize Tensile and Punch Tests
  • 1.5.1.
  • 4.2.2.
  • Specimen Size Requirements for Spherical Indentation
  • 4.2.2.1.
  • Indentation Size Effect
  • 4.2.3.
  • Size Effect in Fracture Toughness Testing
  • 4.3.
  • Issues Related to Specimen Orientation and Stress State
  • 4.4.
  • Specimen Preparation Methods
  • Tensile, Fatigue, and Creep Test Specimens
  • 4.5.
  • Uncertainty in Small Specimen Testing
  • 4.6.
  • Round-Robin Exercises
  • 4.6.1.
  • The European Code of Practice for Small Punch (SP) Testing
  • 4.6.2.
  • Round-Robin Experiments of Ball Indentation
  • 4.7.
  • Concluding Remarks
  • 1.5.2.
  • References
  • 5.
  • Applications of Small Specimen Testing
  • 5.1.
  • Introduction
  • 5.2.
  • Condition Monitoring of Plant Components
  • 5.2.1.
  • Unique Challenges in the Nuclear Industry and Advantages of Small Specimens
  • 5.3.
  • Fracture Toughness Specimens
  • Sampling Techniques
  • 5.3.1.
  • Considerations in Sample Removal
  • 5.4.
  • Field Equipment for In Situ Testing
  • 5.5.
  • Residual Life Assessment
  • 5.6.
  • Properties of Weld Joints
  • 5.7.
  • 1.6.
  • Coatings and Surface-Treated Components
  • 5.8.
  • Material Development Programs
  • 5.8.1.
  • Nanomaterials and Composites
  • 5.8.2.
  • Metallic Glass
  • 5.8.3.
  • Biomaterials
  • 5.9.
  • Machine generated contents note:
  • Need for Specimen Miniaturization
  • Electronic Industry
  • 5.10.
  • Concluding Remarks
  • References
  • 1.6.1.
  • Alloy Design and Development
  • 1.6.2.
  • Periodic Assessment and Life Extension of Engineering Components
  • 1.6.3.
  • Weld Joints and Coatings
  • 1.6.4.
  • Failure Analysis
  • 1.6.5.
  • 1.
  • Micro- and Nanodevices
  • 1.7.
  • Miniaturized Specimen Testing---A Genesis
  • 1.8.
  • Spin-Off Applications of Specimen Miniaturization
  • 1.9.
  • Concluding Remarks
  • References
  • 2.
  • Miniature Specimen Testing for Tensile and Plastic Flow Properties
  • Introduction
  • 2.1.
  • Introduction
  • 2.2.
  • Tensile Tests with Subsize Specimens
  • 2.2.1.
  • Influence of Thickness-to-Grain Size Ratio
  • 2.2.2.
  • Ultra Subsize Specimen Designs
  • 2.2.3.
  • Challenges in Subsize Tensile Testing
  • 1.1.
  • 2.2.3.1.
  • Specimen Machining and Gripping
  • 2.2.3.2.
  • Strain Measurements
  • 2.2.4.
  • Micro- and Nanoscale Tensile Testing
  • 2.2.4.1.
  • Actuation and Force/Displacement Measurement
  • 2.3.
  • Shear Punch Test
  • Materials and Properties
  • 2.3.1.
  • Experimental Methods
  • 2.3.2.
  • Analysis of Load-Displacement Curve
  • 2.3.3.
  • Effect of Specimen Thickness and Clearance Zone
  • 2.3.4.
  • Tensile--Shear Strength Correlations
  • 2.3.5.
  • Ductility from Shear Punch Test
  • 1.2.
  • 2.4.
  • Ball-Indentation Technique
  • 2.4.1.
  • Flow Stress from Indentation
  • 2.4.2.
  • Strain Definition
  • 2.4.3.
  • Cyclic Indentation Tests
  • 2.4.4.
  • Yield Strength from Indentation
  • Mechanical Properties and Microstructure
  • 2.4.5.
  • Contact Area and Pileup/Sink-In Phenomena
  • 2.4.6.
  • Numerical Studies on Ball Indentation
  • 2.4.6.1.
  • Machine Compliance
  • 2.4.6.2.
  • Friction Effects
  • 2.4.6.3.
  • Analysis of Pileup/Sink-In
  • 1.3.
  • 2.4.6.4.
  • Numerical Methods for Stress-Strain Evaluation
  • 2.5.
  • Small Punch Test
  • 2.5.1.
  • Deformation Regimes in Small Punch Tests
  • 2.5.2.
  • Correlation with Tensile Properties
  • 2.5.3.
  • Numerical Studies
Control code
ocn958654155
Dimensions
unknown
Extent
1 online resource
File format
unknown
Form of item
online
Isbn
9781482263923
Isbn Type
(electronic bk.)
Level of compression
unknown
Media category
computer
Media MARC source
rdamedia
Media type code
c
http://library.link/vocab/ext/overdrive/overdriveId
950167
Quality assurance targets
not applicable
Reformatting quality
unknown
Sound
unknown sound
Specific material designation
remote
System control number
(OCoLC)958654155
Label
Miniaturized testing of engineering materials, author: V. Karthik, K.V. Kasiviswanathan, Baldev Raj, (electronic resource)
Publication
Antecedent source
unknown
Carrier category
online resource
Carrier category code
cr
Carrier MARC source
rdacarrier
Color
multicolored
Content category
text
Content type code
txt
Content type MARC source
rdacontent
Contents
  • Techniques for Mechanical Property Characterization
  • 2.6.
  • Concluding Remarks
  • References
  • 3.
  • Miniature Specimens for Fatigue and Fracture Properties
  • 3.1.
  • Subsize Charpy Specimen Impact Testing
  • 3.1.1.
  • Energy Correlation
  • 3.1.2.
  • 1.4.
  • Transition Temperature Correlation
  • 3.1.3.
  • Scaling of Instrumented Impact Test Parameters
  • 3.1.4.
  • Challenges in Subsize Impact Testing
  • 3.2.
  • Fracture Toughness KIC/JIC with Subsize Specimens
  • 3.2.1.
  • Toughness in Transition Regime
  • 3.3.
  • Standards for Mechanical Testing
  • Specimen Reconstitution Methods
  • 3.4.
  • Fatigue and Fatigue Crack Growth Studies Using Subsize Specimens
  • 3.4.1.
  • Fatigue Crack Growth Studies
  • 3.5.
  • Fracture Toughness from Small Punch Technique
  • 3.5.1.
  • Ductile--Brittle Transition from Small Punch
  • 3.5.2.
  • 1.5.
  • Toughness---Lower and Upper Shelf
  • 3.5.3.
  • Small Punch Using Notched Specimen
  • 3.6.
  • Fracture Toughness from Indentation Techniques
  • 3.6.1.
  • Indentation Energy to Fracture
  • 3.6.2.
  • Continuum Damage Mechanics Approach
  • 3.7.
  • Specimen Dimensions
  • Concluding Remarks
  • References
  • 4.
  • Critical Issues in Small Specimen Testing
  • 4.1.
  • Introduction
  • 4.2.
  • Specimen Size Effects and Their Influence on Mechanical Behavior
  • 4.2.1.
  • Size Effect in Subsize Tensile and Punch Tests
  • 1.5.1.
  • 4.2.2.
  • Specimen Size Requirements for Spherical Indentation
  • 4.2.2.1.
  • Indentation Size Effect
  • 4.2.3.
  • Size Effect in Fracture Toughness Testing
  • 4.3.
  • Issues Related to Specimen Orientation and Stress State
  • 4.4.
  • Specimen Preparation Methods
  • Tensile, Fatigue, and Creep Test Specimens
  • 4.5.
  • Uncertainty in Small Specimen Testing
  • 4.6.
  • Round-Robin Exercises
  • 4.6.1.
  • The European Code of Practice for Small Punch (SP) Testing
  • 4.6.2.
  • Round-Robin Experiments of Ball Indentation
  • 4.7.
  • Concluding Remarks
  • 1.5.2.
  • References
  • 5.
  • Applications of Small Specimen Testing
  • 5.1.
  • Introduction
  • 5.2.
  • Condition Monitoring of Plant Components
  • 5.2.1.
  • Unique Challenges in the Nuclear Industry and Advantages of Small Specimens
  • 5.3.
  • Fracture Toughness Specimens
  • Sampling Techniques
  • 5.3.1.
  • Considerations in Sample Removal
  • 5.4.
  • Field Equipment for In Situ Testing
  • 5.5.
  • Residual Life Assessment
  • 5.6.
  • Properties of Weld Joints
  • 5.7.
  • 1.6.
  • Coatings and Surface-Treated Components
  • 5.8.
  • Material Development Programs
  • 5.8.1.
  • Nanomaterials and Composites
  • 5.8.2.
  • Metallic Glass
  • 5.8.3.
  • Biomaterials
  • 5.9.
  • Machine generated contents note:
  • Need for Specimen Miniaturization
  • Electronic Industry
  • 5.10.
  • Concluding Remarks
  • References
  • 1.6.1.
  • Alloy Design and Development
  • 1.6.2.
  • Periodic Assessment and Life Extension of Engineering Components
  • 1.6.3.
  • Weld Joints and Coatings
  • 1.6.4.
  • Failure Analysis
  • 1.6.5.
  • 1.
  • Micro- and Nanodevices
  • 1.7.
  • Miniaturized Specimen Testing---A Genesis
  • 1.8.
  • Spin-Off Applications of Specimen Miniaturization
  • 1.9.
  • Concluding Remarks
  • References
  • 2.
  • Miniature Specimen Testing for Tensile and Plastic Flow Properties
  • Introduction
  • 2.1.
  • Introduction
  • 2.2.
  • Tensile Tests with Subsize Specimens
  • 2.2.1.
  • Influence of Thickness-to-Grain Size Ratio
  • 2.2.2.
  • Ultra Subsize Specimen Designs
  • 2.2.3.
  • Challenges in Subsize Tensile Testing
  • 1.1.
  • 2.2.3.1.
  • Specimen Machining and Gripping
  • 2.2.3.2.
  • Strain Measurements
  • 2.2.4.
  • Micro- and Nanoscale Tensile Testing
  • 2.2.4.1.
  • Actuation and Force/Displacement Measurement
  • 2.3.
  • Shear Punch Test
  • Materials and Properties
  • 2.3.1.
  • Experimental Methods
  • 2.3.2.
  • Analysis of Load-Displacement Curve
  • 2.3.3.
  • Effect of Specimen Thickness and Clearance Zone
  • 2.3.4.
  • Tensile--Shear Strength Correlations
  • 2.3.5.
  • Ductility from Shear Punch Test
  • 1.2.
  • 2.4.
  • Ball-Indentation Technique
  • 2.4.1.
  • Flow Stress from Indentation
  • 2.4.2.
  • Strain Definition
  • 2.4.3.
  • Cyclic Indentation Tests
  • 2.4.4.
  • Yield Strength from Indentation
  • Mechanical Properties and Microstructure
  • 2.4.5.
  • Contact Area and Pileup/Sink-In Phenomena
  • 2.4.6.
  • Numerical Studies on Ball Indentation
  • 2.4.6.1.
  • Machine Compliance
  • 2.4.6.2.
  • Friction Effects
  • 2.4.6.3.
  • Analysis of Pileup/Sink-In
  • 1.3.
  • 2.4.6.4.
  • Numerical Methods for Stress-Strain Evaluation
  • 2.5.
  • Small Punch Test
  • 2.5.1.
  • Deformation Regimes in Small Punch Tests
  • 2.5.2.
  • Correlation with Tensile Properties
  • 2.5.3.
  • Numerical Studies
Control code
ocn958654155
Dimensions
unknown
Extent
1 online resource
File format
unknown
Form of item
online
Isbn
9781482263923
Isbn Type
(electronic bk.)
Level of compression
unknown
Media category
computer
Media MARC source
rdamedia
Media type code
c
http://library.link/vocab/ext/overdrive/overdriveId
950167
Quality assurance targets
not applicable
Reformatting quality
unknown
Sound
unknown sound
Specific material designation
remote
System control number
(OCoLC)958654155

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