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The Resource 3-Dimensional Process Simulation, edited by J. Lorenz

3-Dimensional Process Simulation, edited by J. Lorenz

Label
3-Dimensional Process Simulation
Title
3-Dimensional Process Simulation
Statement of responsibility
edited by J. Lorenz
Creator
Subject
Language
eng
Summary
Whereas two-dimensional semiconductor process simulation has achieved a certain degree of maturity, three-dimensional process simulation is a newly emerging field in which most efforts are dedicated to necessary basic developments. Research in this area is promoted by the growing demand to obtain reliable information on device geometries and dopant distributions needed for three-dimensional device simulation, and challenged by the great algorithmic problems caused by moving interfaces and by the requirement to limit computation times and memory requirements. A workshop (Erlangen, September 5, 1995) provided a forum to discuss the industrial needs, technical problems, and solutions being developed in the field of three-dimensional semiconductor process simulation. Invited presentations from leading semiconductor companies and research Centers of Excellence from Japan, the USA, and Europe outlined novel numerical algorithms, physical models, and applications in this rapidly emerging field
http://library.link/vocab/creatorName
Lorenz, J
Dewey number
621.381
Illustrations
illustrations
Index
no index present
Language note
English
Literary form
non fiction
Nature of contents
dictionaries
http://library.link/vocab/subjectName
  • Engineering
  • Computer simulation
  • Computer-aided design
  • Electronics
Label
3-Dimensional Process Simulation, edited by J. Lorenz
Instantiates
Publication
Antecedent source
file reproduced from original
Bibliography note
Includes bibliographical references at the end of each chapters and index
Color
mixed
Contents
Three-Dimensional Topography Simulator: 3D-MULSS and Its Applications -- A Three-Dimensional Process Simulation using Advanced SMART-P program -- 3-D Topography Simulation Using Surface Representation and Central Utilities -- Three Dimensional Simulation of Thermal Processes -- 3D Process Simulation at IEMN/ISEN -- 3D Simulation of Topography and Doping Processes at FhG -- 3D TCAD at TU Vienna -- Multi-Dimensional TCAD: The PROMPT/DESSIS Approach -- 3D Process Simulation Requirements And Tradeoffs From Industrial Perspective -- Author Index
Control code
ocn851383256
Dimensions
unknown
Extent
1 online resource (viii, 196 pages 164 illustrations)
File format
unknown
Form of item
online
Isbn
9783709169056
Level of compression
uncompressed
Note
SpringerLink
Quality assurance targets
unknown
Reformatting quality
access
Sound
unknown sound
Specific material designation
remote
System control number
(OCoLC)851383256
Label
3-Dimensional Process Simulation, edited by J. Lorenz
Publication
Antecedent source
file reproduced from original
Bibliography note
Includes bibliographical references at the end of each chapters and index
Color
mixed
Contents
Three-Dimensional Topography Simulator: 3D-MULSS and Its Applications -- A Three-Dimensional Process Simulation using Advanced SMART-P program -- 3-D Topography Simulation Using Surface Representation and Central Utilities -- Three Dimensional Simulation of Thermal Processes -- 3D Process Simulation at IEMN/ISEN -- 3D Simulation of Topography and Doping Processes at FhG -- 3D TCAD at TU Vienna -- Multi-Dimensional TCAD: The PROMPT/DESSIS Approach -- 3D Process Simulation Requirements And Tradeoffs From Industrial Perspective -- Author Index
Control code
ocn851383256
Dimensions
unknown
Extent
1 online resource (viii, 196 pages 164 illustrations)
File format
unknown
Form of item
online
Isbn
9783709169056
Level of compression
uncompressed
Note
SpringerLink
Quality assurance targets
unknown
Reformatting quality
access
Sound
unknown sound
Specific material designation
remote
System control number
(OCoLC)851383256

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